AGM X3
Specifications
AGM X3 (X Series)
Processor
Qualcomm Snapdragon 845 8 x 2.8 GHz, Cortex-A75 / A55 (Kryo 385)
Graphics adapter
Memory
6 GB
Display
5.99 inch 18:9, 2160 x 1080 pixel 403 PPI, Capacitive, IPS, glossy: yes
Storage
64 GB eMMC Flash, 64 GB
Connections
Audio Connections: 3.5mm, Card Reader: microSD, Sensors: Accelerometer,Ambient Light Sensor,E-Compass,Gesture Sensor,Gravity Sensor,Gyroscope,Infrared Radiation,Proximity Sensor, USB-C
Networking
802.11 a/b/g/n/ac (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/), Bluetooth 5.0, GSM 1800MHz, 1900MHz, 850MHz, 900MHz || WCDMA B1 2100MHz, B2 1900MHz, B4 1700MHz, B5 850MHz, B8 900MHz || LTE: B1 2100MHz, B12 700MHz, B17 700MHz, B18, B19 800MHz, B2 1900MHz, B20 800MHz, B26, B28 700MHz, B29, B3 1800MHz, B30, B4 1700MHz, B5 850MHz, B7 , Dual SIM, GPS
Size
height x width x depth (in mm): 10.5 x 167.5 x 81.5
Battery
4100 mAh
Operating System
Android 8.1 Oreo
Camera
Primary Camera: 12 MPix 1.28μm, f/1.8, Dual-PD, Portrail mode
Secondary Camera: 20 MPix
Secondary Camera: 20 MPix
Additional features
Keyboard: Virtual, IP68
Weight
200 g
Price
900 Euro
Price comparison
Average Score:
Average of 1 scores (from 2 reviews)
Average of 1 scores (from 2 reviews)
price: - %, performance: 90%, features: - %, display: 90% mobility: 90%, workmanship: 80%, ergonomy: - %, emissions: - %
Reviews for the AGM X3
Outdoor-Smartphone mit Snapdragon 845
Source: Android Pit
DE→zh-CN Archive.org version
Single Review, online available, Medium, Date: 02/21/2019
Source: Android Pit
DE→zh-CN Archive.org versionSingle Review, online available, Medium, Date: 02/21/2019
AGM X3
Source: Chinahandys.net DE→zh-CN Archive.org version
Single Review, online available, Long, Date: 02/21/2019
Rating: Total score: 87% performance: 90% display: 90% mobility: 90% workmanship: 80%
Source: Chinahandys.net
DE→zh-CN Archive.org versionSingle Review, online available, Long, Date: 02/21/2019
Rating: Total score: 87% performance: 90% display: 90% mobility: 90% workmanship: 80%
Comment
Qualcomm Adreno 630:
高通骁龙845 SoC中的集成显卡。据高通公司称，比旧款骁龙835中的Adreno 540快了30％，功耗降低30％。
» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.
SD 845:
适用于智能手机的高端SoC，于2018年初推出，采用台积电的10 nm LPP FinFET制造。 集成了高性能2.8 GHz（最高）4x Kryo 385内核（Cortex-A75），和低功耗1.8 GHz（最高）4x Kryo 385内核，从而提高效率。 此外，还提供X20 LTE调制解调器，交流WiFi和双通道32位1866 MHz LPDDR4x内存控制器。
» Further information can be found in our Comparison of Mobile Processsors.
5.99":
这是比较大的智能手机尺寸，也十分常见。
大尺寸可以让屏幕有更高的分辨率。因而例如字体等的细节将会更丰富。不过另一方面，小屏幕的功耗会较低，而设备也会更轻盈小巧，售价更低。
» To find out how fine a display is, see our DPI List.
» Further information can be found in our Notebook Purchase Guide.
