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MediaTek Dimensity 6100+ | ARM Mali-G57 MP2 | 6.50" | 217 g
联发科 Dimensity 6100+(或 6100 Plus)是一款集成了 5G 调制解调器的中低端 SoC。它包括两个主频高达 2.2 GHz 的快速 ARM Cortex-A76 内核和六个主频高达 2 GHz 的高能效 Cortex-A55 内核(异构多处理八核)。规格与旧款 Dimensity 700 SoC几乎相同。 Dimensity 6020.与 6020 相比,6100+ 的 5 G 速度略高(3.3 Gbps 对 2.7 Gbps),支持蓝牙 5.2(对 5.1),采用略有改进的 6 纳米工艺(对 7 纳米)制造。
此外,该芯片还集成了 2 核 ARM Mali-G57 MC2 GPU、Wi-fi 5 调制解调器、LPDDR4x-2133 内存控制器、人工智能处理单元(APU 3.0)以及视频去噪和编码功能。
Codename | Cortex-A76 / A55 | ||||||||||||
Series | Mediatek Dimensity 6000 | ||||||||||||
Series: Dimensity 6000 Cortex-A76 / A55
| |||||||||||||
Clock Rate | 2000 - 2200 MHz | ||||||||||||
Number of Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||
Manufacturing Technology | 6 nm | ||||||||||||
Features | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision, Wi-Fi 5, Bluetooth 5.2, UFS 2.2, 16GB LPDDR4x Support | ||||||||||||
GPU | ARM Mali-G57 MP2 | ||||||||||||
64 Bit | 64 Bit support | ||||||||||||
Architecture | ARM | ||||||||||||
Announcement Date | 03/01/2023 | ||||||||||||
Product Link (external) | www.mediatek.com |
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