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Vivo Nex 3S 5G

Specifications

Vivo Nex 3S 5G
Vivo Nex 3S 5G (Nex Series)
Processor
Qualcomm Snapdragon 865 8 x 2.4 - 2.8 GHz, Cortex-A77 / A55 (Kryo 585)
Graphics adapter
Memory
8 GB 
Display
6.89 inch 16:10, 2256 x 1080 pixel 363 PPI, glossy: yes
Storage
256 GB UFS
Connections
1 USB 2.0
Networking
802.11 a/b/g/n/ac/ax (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/ax = Wi-Fi 6/), Bluetooth 5.1, Dual SIM, LTE, 5G, GPS
Size
height x width x depth (in mm): 9.4 x 167.4 x 76.1
Battery
4500 mAh
Operating System
Android 10
Camera
Primary Camera: 64 MPix
Secondary Camera: 16 MPix
Weight
220 g

 

Price comparison

Average Score: 87.5% - good
Average of 2 scores (from 4 reviews)
price: - %, performance: 90%, features: - %, display: 90% mobility: 80%, workmanship: 100%, ergonomy: - %, emissions: - %

Reviews for the Vivo Nex 3S 5G

Vivo NEX 3S 5G Review - The 2020 Refresh
Source: TechTablets English Archive.org version
Vivo NEX 3S 5G full detailed review with unboxing. SD865 6.89" SAMOLED Android 10 phone with 64MP camera, 8GB RAM, 256GB UFS 3.1, 4500mAh battery and 16MP pop up selfie camera.
Single Review, online available, Very Long, Date: 04/04/2020
88% Vivo Nex 3s
Source: Chinahandys.net German DE→zh-CN Archive.org version
Single Review, online available, Long, Date: 05/13/2020
Rating: Total score: 88% performance: 90% display: 90% mobility: 80% workmanship: 100%
87% Vivo Nex 3s 5G in prova: estremo ma non troppo | Video
Source: HDblog.it Italian IT→zh-CN Archive.org version
Single Review, online available, Long, Date: 05/05/2020
Rating: Total score: 87%
vivo NEX 3S 5G: wrażenia po kilku dniach. To nie jest zwyczajny smartfon
Source: Komorkomania Turkish PL→zh-CN Archive.org version
Single Review, online available, Long, Date: 04/01/2020

Comment

Qualcomm Adreno 650:

适用于智能手机和平板电脑的图形芯片,集成在Qualcomm Snapdragon 865 SoC中。高通公司声称它比Snapdragon 855 SoC中的Adreno 640快25%,并提供了50%以上的计算单元(ALU)。对于Android,它应该是2020年最快的图形卡之一。

 

» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.


SD 865:

于2019年末推出的高端智能手机SoC,以台积电7纳米制程生产。集成了一个主频高达2.84 GHz的ARM Cortex-A77架构的“Prime Core”。另外三个性能内核也基于A77,频率高达2.42 GHz。此外,还集成了四个基于ARM Cortex-A55架构的节能内核,频率1.8 GHz。除了处理器内核之外,SoC还集成了WiFi 6调制解调器(包括60 GHz mmWave支持),Hexagon 698 DSP(最高15 TOPS)和Spectra 480 ISP。集成内存控制器现在支持高达2750 MHz的更快的LPDDR5内存。 SoC中不再包含LTE,但必须使用外部Snapdragon X55 5G基带。

» Further information can be found in our Comparison of Mobile Processsors.


6.89":

只有较少的手机有很大的屏幕。

大尺寸可以让屏幕有更高的分辨率。因而例如字体等的细节将会更丰富。不过另一方面,小屏幕的功耗会较低,而设备也会更轻盈小巧,售价更低。

» To find out how fine a display is, see our DPI List.


» Further information can be found in our Notebook Purchase Guide.

 

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当前市场报价
Stefan Hinum (Update: 2020-04-29)