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Honor Magic6

Specifications

Honor Magic6
Honor Magic6 (Magic6 Series)
Processor
Qualcomm Snapdragon 8 Gen 3 8 x 2.3 - 3.3 GHz, Cortex-X4 / A720 / A720 / A520 (Kryo)
Graphics adapter
Memory
12 GB 
, or 16GB
Display
6.78 inch 20:9, 2800 x 1264 pixel 453 PPI, Capacitive, OLED, glossy: yes, 120 Hz
Storage
256GB / 512GB
Connections
USB-C Power Delivery (PD), Audio Connections: 3.5mm, 1 Fingerprint Reader, Sensors: Face ID, accelerometer, gyro, proximity, compass, color spectrum
Networking
Wi-Fi 7 (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/ax = Wi-Fi 6/ Wi-Fi 6E 6 GHz be = Wi-Fi 7), Bluetooth 5.3, GSM, CDMA, UMTS, LTE, 5G, Dual SIM, GPS
Size
height x width x depth (in mm): 8.1 x 161.8 x 75.4
Battery
5450 mAh Lithium-Polymer
Operating System
Android 14
Camera
Primary Camera: 50 MPix (f/1.9) + 32MP (2.5x optical zoom, f/2.4) + 50MP (f/2.0, 13mm)
Secondary Camera: 50 MPix f/2.0, 22mm
Additional features
Keyboard: OnScreen
Weight
199 g

 

Price comparison

Reviews for the Honor Magic6

Honor Magic 6 Smartphone Review
Source: OI Spice Tech News English EN→zh-CN
The Honor Magic 6 is the latest flagship smartphone from Honor at the start of 2024. So, Honor includes all the latest components with the highest technological improvements in the smartphone. This included a high-tech display, chipset, battery, and charger. Honor may have created a benchmark when it comes to the highest peak brightness display in a modern smartphone. Well, Honor had to cut some corners in the form of display protection and water and dust resistance. There’s no official IP rating on the smartphone, but it does have some sort of display protection but it’s not as good as Gorilla Glass protection in Samsung flagship smartphones or the Ceramic Shield protection in iPhones. But it also brings super-fast charging capabilities that are not found in those flagship smartphones. So, if water resistance and display protection are a priority for you, then you can go with other smartphones.
Single Review, online available, Medium, Date: 01/23/2024

Comment

Qualcomm Adreno 750: 这是一款用于智能手机和平板电脑的图形芯片,集成在高通公司 Snapdragon 8 Gen 3 SoC 中。高通公司声称,它比骁龙 8 代 2 中的 Adreno 7340 快 25%,而首次基准测试显示,该 GPU 可以击败Apple A17 Pro iGPU。

 

» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.


SD 8 Gen 3: 2022 年底推出的用于智能手机的高端 SoC,拥有一个基于 ARM Cortex-X3 架构的快速主内核,主频高达 3.2 GHz。另外两个高性能内核基于 A715,也仅支持 64 位应用。另外两个 A710 内核与节能型 Cortex-A510 内核一样,也支持 32 位应用。除处理器内核外,SoC 还集成了 WiFi 7 调制解调器、Hexagon DSP(用于人工智能加速)和 Spectra ISP。集成内存控制器支持高达 4200 MHz 的快速 LPDDR5x 内存。芯片中的骁龙 X70 调制解调器支持 5G。» Further information can be found in our Comparison of Mobile Processsors.


6.78":

只有较少的手机有很大的屏幕。

大尺寸可以让屏幕有更高的分辨率。因而例如字体等的细节将会更丰富。不过另一方面,小屏幕的功耗会较低,而设备也会更轻盈小巧,售价更低。

» To find out how fine a display is, see our DPI List.


» Further information can be found in our Notebook Purchase Guide.

 

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Devices from a different Manufacturer and/or with a different CPU

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Devices with the same GPU

Honor Magic V3
Adreno 750, Snapdragon SD 8 Gen 3, 7.92", 0.226 kg
Vivo X Fold3 Pro
Adreno 750, Snapdragon SD 8 Gen 3, 8.03", 0.236 kg
当前市场报价
Stefan Hinum (Update: 2024-04-15)